Building the third dimension of photonic integration
3D-fabricated optical interconnection platform that will scale photonic systems beyond alignment constraints
Vision
The Lightspring platform turns photonic packaging from a bottleneck into a programmable manufacturing step for industry-ready systems
Adaptability
Lightspring is not bound by legacy footprints or specifications. Each connection is shaped to the component it serves — enabling layouts that adapt as designs change.
Precision
Each single design is tuned along components’ material, geometrical and optical properties. Each structure is written at less than 0.1 micron tolerance and automatically aligned.
Speed
Connections are written directly, in a single process step. What used to take days of manual alignment happens in one pass — enabling complex 3D architectures to take shape faster than before.
Scalability
Our process is built to work across foundry recipes, materials, and use cases. The same core method can be replicated at scale, from a single prototype to an entire assembly line.
Technology
We route light in three dimensions, connecting photonic components into systems that scale.
Mode size converter and U-bend array
Lightspring enable new high-performance architectures by connecting chips, fibers and light sources in full 3D beyond classical assembly constraints.
Every connection is designed, characterised, qualified, and diagnosed as one solution, enabling powerful systems to transform industry.
Get in touchProof
Examples of what our lab is working on every day.
Item 1 of 9 — U-bent waveguide
U-bent waveguide
Build with Lightspring
Our ecosystem
Team
We are building a team of photonics experts
LinkedIn — Grégoire BonnatGrégoire Bonnat
Co-Founder & CEO
LinkedIn — Adrià GrabulosaAdrià Grabulosa
Co-Founder & CTO
LinkedIn — Daniel BrunnerDaniel Brunner
Co-Founder & Scientific Director


















